Thermische Nadeln setzen Maßstäbe
19. Feb 2026

Thermische Nadeln setzen Maßstäbe

ESPECIALLY FOR OUR USERS


The current version of Moldex3D 2025 introduces the attribute type “Thermal Pin". This allows pins made of thermally conductive material to be quickly modeled into cooling channel systems.   
When designing cooling systems, it can be beneficial to combine cooling channels containing a medium (usually water) with pins made of a highly thermally conductive material, such as copper. This is particularly useful for dissipating heat from inaccessible areas.
In simulation software, these pins are usually modelled as tool inserts. This requires additional modelling effort and makes combining them with line-based cooling systems difficult or impossible.
To simplify modeling certain cooling channel components with thermal pins, the 'Thermal Pin' attribute was introduced in Moldex3D Version 2025. These components are line-based, meaning that only one line needs to be specified as a model, along with a few parameters. The meshing algorithms then take over the generation of the volume meshes, so the user does not need to control the meshing.
This configuration is particularly useful for partition plate cooling with an integrated copper pin. An example can be seen in the figure. Both the partition plate cooling and the pin are automatically meshed by the software.

The materials and initial temperature assigned to thermal needles are allocated in the same way as for other tool components, such as tool inserts.
 

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