BRISKY computing power with Moldex3D 2023!
EXPERT-TIP
Nowadays 'multi-core computers' are becoming more and more popular. Moldex3D supports multi-core, multi-processor and cluster parallel computing. Users thus have the possibility to flexibly allocate computing resources and effectively reduce simulation time.
The computational performance comparison example (1.68 million grids with an 8-core processor) between version 2022 and Moldex3D 2023 shows that the performance of the enhanced warp analysis analysis is 50% and that of the annealing analysis is even 80% faster.
In a 50,000 wires sweep IC package simulation case the speed of analysis with Moldex3D 2023 increased by as much as 75% compared to Moldex3D 2022. When we use 16 cores for parallel computation, the speed of analysis with Moldex3D 2023 is increased by almost 20 times, which significantly improves simulation performance.
We are more than happy to inform you in detail about Moldex3D. Please contact:
0241 565 276-0 or send an email to sales@simpatec.com.