Fast, detailed and multifunctional IC packaging process simulation

Due to the trend of intellectualization and electric vehicles, global industries have rising demand regarding reliable IC product performance. So, advanced IC packaging technology plays an increasingly critical role for the manufacturing process. Moldex3D’s new potting simulation capabilities are now available for IC packaging users. The pre-processing wizard can quickly generate a high-quality mesh, which saves model preparation time and helps users validate IC packaging designs, which in turn reduces trial and error costs enormously.